Bump adk pin to 9f2fb37 (solder-bump anchor feeds chiplet attachment) - #10
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Mauricio-xx wants to merge 6 commits into
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Bump adk pin to 9f2fb37 (solder-bump anchor feeds chiplet attachment)#10Mauricio-xx wants to merge 6 commits into
Mauricio-xx wants to merge 6 commits into
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Add the plugin's vendored .chiplet reader to the identical-files contract, so the copy H-A introduced (so hyp_to_gds and the clobber guard read through the shared loader) cannot drift from the chiplet-spec reference. Self-test stays green.
The export now writes a content-digest sidecar (two_die_interposer.chiplet.exportcontent.sha256) on every run, and MANIFEST.md documents the optional metal-fill artifacts. Regenerated headless against the merged studio/plugin/adk pins so adk-verify-demo-reproducible passes; two independent regens agree byte-for-byte over the baked set.
The merged export toolchain imports PyYAML at module load, and the --system-site-packages venv is the interpreter that carries it (plus pcbnew), matching how bin/hyp-to-gds execs the worker. adk-smoke:27 was the last bare-python3 export call in bin/ and the Dockerfile.
The tolerant chiplet_format_io reference imports yaml at module load, so the demo-regen orchestrator needs the venv python (pcbnew + PyYAML), not bare system python3.
studio 7caeaa9 (C++ re-vendor), plugin 4b270d4 (guarded .chiplet loader), adk 385703d (re-synced vendored cfio). Full verify green on the merged pins: studio ctest 585/585, plugin pytest 365+69, demo regen, reproducibility, adk-smoke.
Upstream: IHP-GmbH/IHP-Open-ADK 385703d..9f2fb37 (dev head). Declarative change to pdk_adapters/interposer/intm4tm2.drc only: solder-bump attachments (9/36 AND 41/36) now reach chiplet_attachment_input, a no-op on the demo. ci-gate is green on 9f2fb37 (push-triggered run on adk dev). Verified by the hosted integration context on this PR.
Mauricio-xx
marked this pull request as draft
August 31, 2026 11:06
Mauricio-xx
marked this pull request as ready for review
August 31, 2026 11:13
Mauricio-xx
marked this pull request as draft
August 31, 2026 11:17
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Advance the tools/adk pin from 385703d to 9f2fb37 so the assembly DRC checks solder-bump attachments.
The adk change is a single declarative edit to pdk_adapters/interposer/intm4tm2.drc: solder-bump anchors (passiv 9/36 AND dfpad 41/36) now join the Cu-pillar anchor into chiplet_attachment_input, so the stage no longer skips solder-bump interconnect checks. It is a no-op on the two_die_interposer demo (Cu-pillar only). ci-gate is already green on 9f2fb37 upstream; this PR lets the hosted integration context confirm the combination. Gitlink-only, no other files.